Electroplating Engineers of Japan Ltd. Trademarks
CUP-PLATER
Filed: September 13, 1995
bump plating machine for wafer
Owned by: Electroplating Engineers of Japan Ltd.
Serial Number: 74728652
POSPEC
Filed: September 20, 1995
inspection sorting machine for plated bump height and bump size of semiconductor wafer
Owned by: Electroplating Engineers of Japan Ltd.
Serial Number: 74735250
CUPLAND
Filed: June 16, 1997
electroplating machines
Owned by: Electroplating Engineers of Japan Ltd.
Serial Number: 75310017
