HEYCLEAR - Trademark Details
Status: 630 - New Application - Record Initialized Not Assigned To Examiner
Image for trademark with serial number 98876068
Serial Number
98876068
Word Mark
HEYCLEAR
Status
630 - New Application - Record Initialized Not Assigned To Examiner
Status Date
2024-11-27
Filing Date
2024-11-27
Statements
Indication of Colors claimed
Color is not claimed as a feature of the mark.
Description of Mark
The mark consists of the word "HeyClear" in a stylized font. To the left of the text, there is an abstract design resembling a butterfly or bowtie shape, composed of curved lines that form a symmetrical. The letter "C" in "HeyClear" includes small sparkles or star-like shapes.
Goods and Services
Silicon; Acrylic resins, unprocessed; Artificial resins, unprocessed; Epoxy resins, unprocessed; Gum arabic for industrial purposes; Polymer resins, unprocessed; Silica gel; Synthetic resins, unprocessed
Translation of Words in Mark
The wording HeyClear has no meaning in a foreign language.
Classification Information
International Class
001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins, unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry. - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins, unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
US Class Codes
001, 005, 006, 010, 026, 046
Class Status Code
6 - Active
Class Status Date
2024-11-27
Primary Code
001
First Use Anywhere Date
2024-08-20
First Use In Commerce Date
2024-08-20
Current Trademark Owners
Party Type
10 - Original Applicant
Address
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Correspondences
Name
Benjamin Michael Mot
Address
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Trademark Events
Event DateEvent Description
2024-11-27NEW APPLICATION ENTERED