"HANMI" - Trademark Details
Status: 630 - New Application - Record Initialized Not Assigned To Examiner
Serial Number
98846302
Word Mark
"HANMI"
Status
630 - New Application - Record Initialized Not Assigned To Examiner
Status Date
2024-11-11
Filing Date
2024-11-11
Attorney Name
Statements
Indication of Colors claimed
The color(s) blue and red is/are claimed as a feature of the mark.
Description of Mark
The mark consists of the word "HANMI" in blue surrounded by a red frame with straight and curved features, the white in the mark representing a transparent area..
Goods and Services
Die attachment equipment for manufacturing semiconductor; semiconductor flip chip bonding machine; thermocompression bonding apparatus for manufacturing semiconductor; PICK PLACE equipment for manufacturing semiconductor; die bonding equipment for manufacturing semiconductor; electronic components placement machines and apparatus for manufacturing semiconductor; semiconductor chip mounting equipment; semiconductor package electromagnetic shielding equipment; semiconductor wafer processing equipment; hybrid bonding equipment for manufacturing semiconductor
Classification Information
International Class
007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements (other than hand-operated); incubators for eggs. - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements (other than hand-operated); incubators for eggs.
US Class Codes
013, 019, 021, 023, 024, 031, 034, 035
Class Status Code
6 - Active
Class Status Date
2024-11-11
Primary Code
007
First Use Anywhere Date
2000-12-01
First Use In Commerce Date
2000-12-01
Current Trademark Owners
Party Name
Party Type
10 - Original Applicant
Legal Entity Type
03 - Corporation
Address
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Correspondences
Name
Sangwon Kim Revolution IP, PLLC
Address
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Trademark Events
| Event Date | Event Description |
| 2024-11-11 | NEW APPLICATION ENTERED |
