Agents for use in soldering in microelectronic industry; soldering pastes

Lead-free solders for the microelectronic industry, in particular microelectronic chip industry, in particular tin comprising solders; pastes and inks of soldering preparations for wave soldering, THT-soldering, through-hole technology-soldering, and SMD-soldering, surface mounted technology soldering, wherein the pastes and inks comprising solder metal and their alloys and flux for printing of electronic components, in particular in chip-industry, semiconductor-industry, consumer electronic-industry and automotive-industry; pastes and inks of soldering preparations comprising solder metal and their alloys and flux for depositing, in particular printing of electronic components in semiconductor-industry to be soldered semi-automatically or fully automatically after placement; pastes and inks of soldering preparations comprising solder metal and their alloys and flux for depositing, in particular printing, of electronic components in semiconductor-industry to be soldered semiautomatically or fully automatically after placement, wherein the pastes and inks comprises as solder metal and their alloy as soft solder in form of a powder having a particle size of less than 100 micrometer of tin, copper, zinc and/or silver or an alloy of at least two of the metals; pastes and inks of soldering preparations comprising solder metal and their alloy and flux for printing of electronic components in industry, such as microelectronic contacts and/or microelectronic conducting paths, in particular in stencil printing, screen printing, mask printing processes, in particular each followed by a heating up to less than 300 Degrees-Celsius, in particular the solder metal and their alloys comprising tin, copper, zinc and/or silver or an alloy of at least two of the metals; pastes and inks of soldering preparations comprising solder metal and their alloy and flux for printing of electronic components in industry, in particular in microelectronic industry, preferred in microelectronic chip industry, consumer electronic industry, semiconductor-industry, and/or automotive industry, in particular the solder metal and their alloys comprising tin, copper, zinc and/or silver or an alloy of at least two of the metals, preferred the solder is free from iron and free from lead; common metals, precious metals, and their alloys in powder form, free form iron and free form lead, wherein the particles of the powder having a particle size of less than 50 micrometer for use in depositing pastes, printing pastes and printing inks for the production of electronic conducting paths and/or electronic conducing contacts in microelectronic industry, in particular for use in chip-production with pitches or line space below 300 micrometer; All goods preferred for use in chip-production with pitches or line space from 100 nanometer up to 200 micrometer; All goods preferred for use in processes for the production in microchip industry for surface mountable devices (SMD), surface mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), in particular comprising as metals tin, copper, zinc and/or silver or an alloy of at least of two of the metals; pastes and inks comprising common metals, precious metals and alloys in powder form and flux, wherein the metals and alloys are free from iron and free from lead, wherein the particles of the powder having a particle size of less than 50 micrometer, in particular pastes and inks according to Industry Specifications, such as IPC, preferred IPC J-STD-005A:2012-02-14 classes T5 to T8 and/or IPC J-STD-001; pastes and inks of soldering preparations comprising spherical particles of soft solder in a dispersing media comprising flux, in particular organic flux of mixture of solvents and resins and optional activated chemicals to provide pastes and inks viscosity for depositing, in particular by printing, wherein the spherical particles have an aspect ratio of the diameters of nearly 1; pastes and inks of soldering preparations comprising spherical particles of soft solder and flux, wherein the particles are obtained in a dispersion process in which liquid metal or liquid alloy is dispersed in a dispersing media, wherein the flux comprises organic flux to provide pastes and inks a viscosity for depositing; Preferred all goods for depositing, in particular by printing, underfill technologies for flip-chip (FC), and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), preferred according to Industry Specifications (IPC); soft solder for microelectronic application in the form of a printable paste for use in microelectronic application, wherein the paste comprises powder having a particle size of less than 50 micrometers of tin, copper, zinc and silver; in particular all of the above mentioned goods comprising tin; in particular all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and/or iron-containing components, in particular in the field of gas and water pipes