electromagnetic absorbing and shielding materials, namely, composite metal sheets of ferrite and carbon that absorbs electromagnetic energy in radio waves and changes such energy to heat; ITO (Indium-Tin-Oxide) metal plates, namely, transparent electric conduction plates made of indium oxide and tin oxide; Conductive metal plates, namely, transparent electric conduction plates; metal accessories for assemblies holding ferrite magnetic cores, namely, bobbins

flip chip mounting machine for the manufacture of electric, electronic and semiconductor devices and components; FOUP Load Port, namely, a station for supporting a semiconductor wafer transporting container where the cover of the transporting container is separated or separable from the transporting container

Ferrites in the nature of magnetic cores; Electronic components in the nature of capacitors; ceramic capacitors; multilayer ceramic capacitors; electrical inductors; coil inductors; electromagnetic capability components, namely, capacitors, inductors, chip beads, varistors, and electromagnetic shield materials made from ceramic or ferrite; ferrite chip beads; Filters in the nature of electronic components, namely, filters for electrical signals; filters to control signal frequencies; filters for radio interference suppression; electromagnetic compatibility filters used for filtering electrical signals; 3-terminal filters, comprised of an input, output and a ground, in which an inductor and a capacitor are used for the filtering of electromagnetic compatibility problems; common mode filters for absorbing and removing common mode noise; choke coils; common mode choke coils which are used to prevent electromagnetic interference and radio frequency interference from power supply lines and to prevent the malfunctioning of electric equipment by passing differential currents while blocking common mode currents; RF (radio frequency) components, namely, filters, isolators, duplexers and couplers; antennas, namely, ceramic patch antennas, ceramic chip antennas, multilayer chip antennas; pass band filters, namely, electronic filters that pass frequencies within a certain range and reject frequencies outside that range; pass band filters from dielectric materials, namely, ceramic and ferrite; multiplexers; diplexers; multilayer diplexers; pass band filters in a multilayer form; thin-film laminated pass band filters; Electrical components in the nature of strip lines, namely, an electromagnetic transmission line medium consisting of flatmetal strip center conductors which are separated from flat metal-strip outer conductors by dielectric strips; low pass filters; low pass filters in multilayer form; high pass filters; high pass filters in multilayer form; baluns; balun transformers; multilayer balun transformers; thin film balun transformers; electrical components in the nature of couplers, directional electrical signal couplers, multilayer directional electrical signal couplers; wireless LAN modules in the nature of adapters that enable devices to access wireless networks; electric resistors; SAW (Surface Acoustic Wave) filters for interference suppression of electrical fault clearance for use in the fields of industry of electronics, telecommunications, medical technology, consumer electronics, household appliances, data processing, building services, engineering and traffic engineering; Surface Acoustic Wave resonators; Electronic circuits, namely, RF modules; SAW modules; bulk acoustic wave components, namely, filters and duplexers; film bulk acoustic wave components, namely, bulk acoustic resonators, bulk acoustic filters, bulk acoustic duplexers, bulk acoustic electronic sensors; Voltage product devices, namely, voltage surge protectors, voltage surge suppressors, and lightning arresting equipment; varistors; varistors in multilayer form; Current protection devices, namely, electrical surge arrestors, varistors, electricity limiters, and thermistors; NTC (negative temperature coefficient) thermistors; PTC (positive temperature coefficient) thermistors; Temperature protection devices, namely, thermistors for use in electronic circuits, and semiconductors for use as temperature sensors; Electronic sensors that detect temperature, humidity, magnetism, pressure, speed, position, angle and voltage; temperature responsive reed switches; humidity sensors; surface potential sensors to measure the surface electrical potential of a drum or paper in copiers or printers; gear tooth sensors to measure a rotation angle of a cam crank; gear tooth sensors used in automobiles for angle sensing; gear tooth sensors used in automobiles for speed sensing; toner concentration and residual volume sensors for printers; powder level sensors for printers; electromagnetic sensors; piezoelectric components, namely, piezoelectric filters, receivers, buzzers, actuators, resonators, sensors, nebulizers, ultrasonic nebulizer units and pulse-height discriminators for sensing a pulse signal above a user-prescribed level; piezoelectric ceramic filters, namely, electric and electronic filters made of piezoelectric ceramic materials that generate electrical voltage in response to applied mechanical stress and that change shape when electrical voltage is applied; transformers; electrical and electronic transformers; pulse transformers; current transformers; magnetic sheets made from ferrite and carbon that absorbs electromagnetic energy in radio waves and changes it into heat; radio wave absorbing materials made from ferrite and carbon and base materials namely, styrene foam, a foaming polyethylene, and an inorganic materials, that absorbs radio waves; microwave absorbing materials made from ferrite and carbon and base materials, namely, styrene foam, a foaming polyethylene, and an inorganic material that absorbs microwaves; electromagnetic wave absorbing materials made from ferrite and carbon and base materials, namely, styrene foam, a foaming polyethylene, and an inorganic material that absorbs electromagnetic wave; power supplies; AC (alternate current) input power supplies; DC (direct current) to DC (direct current) converters; DC (direct current) to AC (alternate current) inverters; switching power supplies, namely, switch-mode power supplies; UPS (uninterruptible power systems), namely, a device that backs up systems by supplying power instantly when power stops due to power failures; magnets; ferrite magnets; plastic bonded magnets; rubber bonded magnets; memory controllers, namely, a digital circuit which manages the flow of data going to and from the main flash memory; non-volatile memory controllers in the nature of electrical circuits; flash memory controllers in the nature of electrical circuits; NAND-type flash memory controllers, namely, a digital circuit which manages the flow of data going to and from the main NAND-type flash memory; flash memory data storage semiconductor chips; memory cards; blank flash memory cards; non-volatile memory data storage semiconductor chips; non-volatile blank memory cards; blank CF (compact flash) cards; blank CF (compact flash) card for industrial applications; SSD (solid state drive); SSD (solid state drive) for industrial applications; semiconductor devices; semiconductor memories; memory card adapters; Electromagnetic coils; electric coils; magnetic and electromagnetic coils for wireless charging of electronic products; circuit boards; printed circuit boards; electronic circuit boards; integrated circuit boards; semiconductor boards; Parts and fittings for electric and electronic apparatus, namely, units consisting of an assembly of electronic components incorporated into radio frequency circuits, electrical power supplies, integrated circuits and capacitors; electronic integrated circuits; integrated circuits; large scale integrated circuits; printed circuits; Components for hard discs drives, namely, Magnetic heads, parts and components, namely, head sliders, head gimbal assemblies (HGA), head arm assemblies (HAA), head stack assemblies (HSA), or head coil assemblies (HCA); rechargeable batteries; Lithium-ion batteries; rechargeable lithiumion polymer batteries; accessories for ferrites for making assemblies holding ferrites, namely, bobbins, springs, yokes, clips, clamps, bands, cases, covers, electrical feed connectors, magnetostrictive vibrators, bias magnets, trimmers and flanges; SAW (Surface Acoustic Wave) components, namely, SAW (Surface Acoustic Wave) resonators

Substrates primarily of silicon, ceramic, resin, and non-metals for micro-modularization of function circuitry, namely, circuit substrates; printed circuit substrates; electronic circuit substrates; integrated circuit substrates; semiconductor substrates; circuit embedded substrates; electronic circuit embedded substrates; integrated circuit embedded substrates; semiconductor embedded substrates

Non-metal accessories made from ceramic or resin for assemblies holding electronic components in the nature of magnetic ferrite cores, namely, bobbins