Semiconductors for high frequency integrated circuits (IC) that includes radio frequency and microwave; integrated circuits for high frequency switches that includes radio frequencies and microwaves; electronic devices which incorporate high frequency integrated circuits, namely, antenna switch module, radio frequency (RF) front end module, wireless data communication module comprised of Antenna, radio frequency front end integrated circuits, modem integrated circuits and baseband processor integrated circuits on the glass-epoxy board or the Low Temperature Co-fired Ceramics (LTCC) board all sold as a unit for use in wireless networking apparatus, hands free apparatus and the cellular phone for providing wireless data connectivity between portable electronic devices and a base station, between portable electronic devices and devices for hands-free uses of portable electronic devices, between cellular telephones and a base station and between cellular telephones and devices for hands-free uses of cellular telephones, data communication card and wireless data communication dongle for providing wireless data connectivity between portable electronic devices and a base station, between portable electronic devices and devices for hands-free uses of portable electronic devices, between cellular telephones and a base station and between cellular telephones and devices for hands-free uses of cellular telephones