Machines used in the semiconductor manufacturing and processing industry, namely, auto molding machines, singulation machines, encapsulation machines, solder ball placement machines, flip-chip bonding machines, machines for testing semiconductors, dies or wafers, machines for inspecting semiconductors, dies or wafers, and machines for packing semiconductors, dies or wafers; semiconductor manufacturing equipment, namely, flip-chip bonding machines; semiconductor and wafer level inspection machines, namely, automated optical inspection machines and multiple image capture machines; scan-pack machines, namely, integrated tray based mark scan pack machines, turret based scan pack machines and gravity feed scan pack machines; tape and reel machines, namely, three in one de-taper, reel to tube de-taper, manual tape system and part counter system; [ sorting ] * sorter * machines; all included in this class

Apparatus and instruments for use in the process of manufacture and inspection of semiconductors and integrated circuits, namely, automated optical inspection machines and multiple image capture machines, integrated tray based mark scan pack machines, turret based scan pack machines, gravity feed scan pack machines, light controller and adaptive light controller; electrical sockets and electrical contactors for testing the electrical functionality of a completed integrated circuit package; embossed carrier tapes for supporting and packing electronic devices and components, namely, three in one de-taper, reel to tube de-taper, manual tape system and part counter system; electrotechnical and electronic apparatus, equipment and instruments all for use in the fields of equipment development, semiconductor manufacturing technology, namely, light controller and adaptive light controller, part counter system; computer hardware and software for machine vision applications, namely, locating, guiding, identifying, measuring and inspecting objects and detecting, classifying and reporting on measurement, orientation, defects thereon; all included in this class,"

Installation of machines for use in semiconductor industry including bonding, auto molding, singulation and encapsulation, testing, inspecting and packing of integrated circuits, wafers and electrical devices and components; consultancy relating to semiconductor machinery installation; repair and maintenance of semiconductor machines, apparatus and components for use in the fields of manufacturing of and processing of semiconductor devices; repair and manufacture of semiconductor probe cards and integrated circuit electrical test sockets; all included in this class

Assembly of semiconductors for others; contract and custom manufacturing services of equipment, parts, modules and components for others, and specifically in the medical, scientific and semiconductor industries; custom manufacturing of semiconductor tape and reel manufacturing for others; custom manufacturing services for others in the nature of semiconductor pillar bumping services; custom manufacturing services for others in the nature of embedding written programs into semiconductor devices; custom manufacturing services for others in the nature of semiconductor lead conditioning services; custom manufacturing services for others in the nature of semiconductor detaping services; all included in this class

Design, maintenance, development of computer software for use in the electronics and semiconductor industries; providing technological consultancy in the technology field of testing, inspection, packing, auto molding, bonding and analysis of semiconductor devices; advisory and consultancy services in connection with the design of machines, apparatus and instruments for use in the electronics and semiconductor industries; all included in this class