Integrated circuit packages for semi-conductors, namely, semiconductor chip housings; semiconductor chip packages containing semiconductor chip housings and semiconductor chips; packages for crystal resonator or SAW, Surface Acoustic Wave, filter, namely, protective housings for crystal resonator or SAW Surface Acoustic Wave, filter; leadless chip carriers, namely semiconductor chip housings; semiconductor devices, namely interposers for semiconductors, namely, connectors for semiconductors; printed wiring boards for semi-conductors; integrated circuit packages for semi-conductors, namely, pin grid array chip packages consisting of supporting boards on which pins are gridded array; integrated circuit packages for semi-conductors, namely, ball grid array chip packages consisting of supporting boards on which balls are gridded array; integrated circuit packages for semi-conductors, namely, flat packages consisting of housings for integrated circuits; integrated circuit packages for semi-conductors, namely, packages consisting of supporting boards and housings for integrated circuits for high frequency band; aluminum nitride products, namely, ceramic integrated circuit packages consisting of ceramic housings and supporting boards used in the manufacture of CPUs, Central Processing Units, or MPUs, Micro Processor Units; integrated circuit packages for semi-conductors, namely, ceramic packages consisting of ceramic housings and supporting boards used in the manufacture of CPUs, Central Processing Units, or MPUs, Micro Processor Units; electric wires, namely printed wiring; printed circuit boards, namely, multilayer circuit boards; substrates for semi-conductors, namely, supporting boards on which electronic devices including integrated circuits, chip condensers and chip capacitors are attached or in which electronic devices including integrated circuits, chip condensers and chip capacitors are embedded; polyimide thin film multilayer substrates for semi-conductors, namely, supporting material on which electronic devices including integrated circuits, chip condensers and chip capacitors are attached; multi-chip module substrates, namely, supporting boards on which integrated circuits, chip condensers, chip capacitors, chip resistors and chip inductors are installed; glazed substrates for thermal printer heads, namely, supporting boards which are attached in thermal printer heads