Ceramic compositions in the solid state for manufacture of alumina High Temperature Cofired Ceramic (HTCC) and Low Temperature Co-Fire Ceramic (LTCC); aluminum nitride (AIN) for use in the manufacture of ceramic electronic components; ceramic compositions in the solid state for manufacture of ceramic electronic components, namely, non-metal ceramic substrates

Ceramic and metal electronic components, namely, single and multi-layer co-fire ceramic packages, ceramic packages, ceramic packaging, multi layer ceramics and brazed assemblies therefor all for micro electronic high reliability applications for use in combination with microchips, resistors and capacitors; ceramic chip scale packaging, namely, integrated circuit packages that contact pads instead of pins or wires; ceramic pin grid arrays and ceramic ball grid arrays all in the nature of configurations for microprocessor sockets on computer motherboards; multi chip integrated circuit modules; feedthroughs, namely, ceramic co-fired conductors hermetically connecting two circuits on opposite sides of a metal housing; heat spreaders for removing heat from high power devices in a ceramic package; leadless ceramic chip carriers, namely, semiconductor chip housings; brazed metal electronic assemblies, namely, quad flat packs and dual in-line packages for use with integrated circuits