Substrates for semi-conductors, namely, supporting board on which electronic devices including integrated circuits, chip condensers and chip capacitors are attached or in which electronic devices including integrated circuits, chip condensers and chip capacitors are embedded; glazed substrates for thermal printer heads, namely, supporting boards which are attached in thermal printer heads; polyimide thin film multilayer substrates for semiconductors, namely, supporting material on which electronic devices including integrated circuits, chip condensers and chip capacitors are attached; integrated circuits and circuit boards for semiconductors; chip packages, namely, protective housings for semiconductor chips attached to printed circuit boards; crystal resonator SAW (Surface Acoustic Wave) filter package, namely, protective housings for crystal resonator, SAW (Surface Acoustic Wave) and filter; leadless chip carriers, interposers for semi-conductors, namely, connectors for semi-conductors; printed circuit boards; flexible printed circuit boards; printed wiring boards; pin grid array chip packages, namely, supporting boards on which pins are gridded arrayed; ball grid array chip packages, namely, supporting boards on which balls are gridded arrayed; flat packages, namely, housings for integrated circuits; multi-chip module substrates, namely, supporting board on which integrated circuits, chip condensers, chip capacitors, chip resistors and chip inductors are installed; packages for high frequency band, namely, protective housings for electronic devices working in high frequency band area; aluminum nitride products, namely, ceramic housings and supporting boards used in the manufacture of integrated circuits; cerdips, namely, ceramic housings and supporting boards used in the manufacture of integrated circuits; printed wiring boards for use in connecting semiconductor components on printed circuit boards; multilayer printed circuit boards