Electronic components for communication devices that incorporate micro-electro-mechanical system (MEMS) devices, namely semiconductors, integrated circuits, antennas, capacitors, inductors, hybrid Film Bulk Acoustic Resonators (FBAR), Micro-Electro-Mechanical Systems (MEMS), electronic filters, mechanical filters, micro-electro-mechanical systems (MES) filters, surface-acoustic wave filters, ceramic filters, Film Bulk Acoustic Resonator (FBAR) filters, integrated circuit modules, radio frequency (RF) modules, intermediate frequency modules (IF) modules, baseband frequency modules, tunable filter modules, switchable filter modules, microelectro-mechanical system (MEMS) modules, microprocessor modules, digital signal processing (DSP) modules, antenna modules, power amplifier (PA) modules, low-noise amplifier (LNA) modules, multi-chip modules, voltage-controlled oscillator modules, electronic switches, mechanical switches, radio frequency (RF) switches, intermediate frequency (IF) switches, baseband switches, test switches, micro-electro-mechanical systems (MEMS) switches, semiconductor switches, integrated circuit switches, electronic relays, mechanical relays, microelectro-mechanical systems (MEMS) relays, integrated circuit relays, semiconductor relays, integrated circuit relays, power switching relays, radio frequency relays, intermediate frequency relays, baseband frequency relays, oscillators, radio frequency (RE) oscillators, voltage-controlled oscillators, micro-electro-mechanical systems (MEMS) oscillators