Inks for use in the process of producing printed circuit boards, namely, printing inks, marking inks, inks for hole plugging, and solder resist inks, namely, inks for coating or printing in the process of producing package application boards, inks for coating or printing in the process of producing flexible printed boards and inks for coating or printing in the process of producing display panels, namely, plastic package substrate alkaline developable solder resist inks, plastic package substrate solder resist inks, package substrate solder resist inks, alkaline developable solder resist inks, CSP developable solder resist inks, and BGA developable solder resist inks; Chemicals for use in the process of producing printed circuit boards, namely, solder resist inks, and marking inks

Electrical insulating materials for insulating coating or printing materials for use in the process of producing printed circuit boards, namely, insulating resin materials for use in the process of producing build-up boards; insulating resin materials for dry film type intermediate dielectric materials for use in the process of producing build-up boards; insulating coating materials for use in the process of producing display panels; insulating plugging material for use in filling holes in the manufacture of printed circuit boards; and insulating solder mask for use in the process of producing printed circuit boards, namely, solder resist dry films, plastic package substrate alkaline developable resist dry films, plastic package substrate solder resist dry films, package substrate solder resist dry films, and alkaline developable solder resist dry films