[ ORGANIC SOLVENTS USED AS THINNERS FOR SOLUTIONS OF SYNTHETIC RESINOUS MATERIALS FOR USE TO FORM COATINGS ON ELECTROPLATING APPARATUS AND PARTS THEREOF; ORGANIC SOLVENTS USED AS REMOVERS OF COATINGS OF SYNTHETIC RESINOUS MATERIAL; ] CHEMICAL COMPOSITIONS IN PREPARED FORM FOR USE IN MAKING UP SOLUTIONS FOR STRIPPING COATING METALS FROM BASIS METALS; CHEMICAL DIPPING COMPOSITIONS FOR MAKING UP SOLUTIONS FOR USE IN THE TREATMENT OF METALS; [ STOP-OFF COMPOUNDS IN THE FORM OF SOLUTIONS APPLIED TO METAL PARTS WHICH ARE BEING ELECTROPLATED TO INHIBIT DEPOSITION AND CHEMICAL ATTACK ON THE PART COVERED BY THE STOP-OFF COMPOUND, AND ORGANIC SOLVENTS, DESIGNATED AS THINNERS FOR THINNING THE SOLUTIONS OF SAID STOP-OFF COMPOUNDS; ] STOP-OFF COMPOUNDS IN THE FORM OF WAX-LIKE COMPOUNDS APPLIED TO METAL PARTS WHICH ARE BEING ELECTROPLATED, TO INHIBIT DEPOSITION AND CHEMICAL ATTACK ON THE PART COVERED BY THE STOP-OFF COMPOUND; ELECTROPLATING COMPOSITIONS IN PREPARED FORM [ ; PAPERS IMPREGNATED WITH DYESTUFFS OF THE CLASS KNOWN AS "INDICATORS," FOR TESTING HYDROGEN ION CONCENTRATION (PH) OF SOLUTIONS ]